| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer cleaning method with which destruction of a fine structure on a wafer can be suppressed, and to provide a spin cleaning device realizing such cleaning. SOLUTION: In the spin cleaning device, cleaning liquid is jetted on a wafer face while a nozzle is moved, and a cleaning liquid collision spot is irradiated with an ultrasonic wave generated inside the nozzle so as to clean the wafer face. The device has at least one function out of the functions (1) to (4). There are the function (1) for changing the number of rotations of the wafer in accordance with a position of the cleaning liquid collision spot on the wafer, the function (2) for changing moving speed in a direction parallel to the wafer of the nozzle in accordance with the position of the cleaning liquid collision spot on the wafer, the function (3) for changing output of the ultrasonic wave in accordance with the position of the cleaning liquid collision spot on the wafer, and the function (4) for changing a distance between the nozzle and the cleaning liquid collision spot in accordance with the position of the cleaning liquid collision spot on the wafer. COPYRIGHT: (C)2007,JPO&INPIT
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