| 摘要 |
PROBLEM TO BE SOLVED: To provide a probe tip manufacturing method capable of easily manufacturing probe tips having a prescribed shape on a substrate without having to use a lithography technique nor an etching technique. SOLUTION: In the method for manufacturing probe tips to be formed on a substrate correspondingly to the positions of electrode pads of a semiconductor device to be inspected, metal powder is three-dimensionally sintered at prescribed locations on the substrate on the basis of shape information including the shapes of probe tips and locations at which the probe tips are to be formed on the substrate to manufacture the probe tips. COPYRIGHT: (C)2007,JPO&INPIT
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