发明名称 |
Heat-radiating semiconductor chip, tape wiring substrate and tape package using the same |
摘要 |
A semiconductor chip, a tape package of the chip and a tape wiring substrate of the chip may be configured so as to effectively radiate heat generated from the chip externally through certain wiring patterns connected to certain pads. In an example, the chip may include a plurality of input pads along at least one edge of an active surface. The input pads may include power pads and ground pads. The chip may include a plurality of output pads along edges of the active surface, outside of the input pads. The power pads and the ground pads may be located at a central area of the at least one edge.
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申请公布号 |
US2007152329(A1) |
申请公布日期 |
2007.07.05 |
申请号 |
US20060488057 |
申请日期 |
2006.07.18 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
CHO YOUNG-SANG;KIM DONG-HAN |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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