| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve arrangement density to a base member whose mounting face is circular. <P>SOLUTION: An LED package P is provided with a mounting substrate 20 on which an LED chip 10 is mounted, and a color conversion member 70 fixed to the mounting face-side of the LED chip 10 in the mounting substrate 20 in such a form that the LED chip 10 is stored between the mounting substrates 20. The outer peripheral shape of the mounting substrate 20 is trapezoidal. When an angle formed of two sides among four sides of the trapezoidal mounting substrate 20 is set as θ, the angle θ is set to a value (namely, θ=360÷n) obtained by dividing 360° by the number (n) of LED packages P mounted on the mounting face. <P>COPYRIGHT: (C)2007,JPO&INPIT |
