| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device which never causes distortion or connection failure due to thermal hysteresis in manufacturing or usage. <P>SOLUTION: In the semiconductor device on which semiconductor chips each having power consumption of 20 W or less are mounted, a polyimide film having a curling degree of 10% or less at 300°C is used as an insulation base material and a plurality of semiconductor chips are mounted and packaged on a printed wiring board having two or more conductor layers. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
