| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a chip component mounting method which is capable of preventing the displacement of a chip component when it is mounted. <P>SOLUTION: A solder material 33 attached to a land terminal 21 on a circuit board 1 is flattened. Furthermore, a flux 37 is applied onto the flattened solder material 33. Thereafter, the chip component 5 is arranged in such a state in which it is mounted on the solder material 33 through the flux 37. U-shaped grooves 41 and 42 are formed on the surface of the solder material 33 at the same time when the solder material 33 is flattened or before the flux 37 is applied after the solder material 33 has been flattened. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
