| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer substrate which can make the contraction percentage in the x-y direction small when dissimilar materials are baked at the same time, and moreover, can prevent protrusions or depressions of via-hole conductors, and defective continuity accompanying them. SOLUTION: The multilayer substrate is made by laminating a plurality of insulating layers 11a to 11e. At least one layer of a plurality of the insulating layers 11a to 11e is dissimilar material insulating layer 11a or 11e different from the other insulating layers 11b to 11d. Via-hole conductors 14a and 14b which contain a metal and a glass are provided in the other insulating layers 11b to 11d and the dissimilar material insulator 11a and 11e. The softening point of the glass in the via-hole conductor 14a in other insulating layers 11b to 11d is lower than a temperature when baking and shrinking of the other insulating layers 11b to 11d start. The softening point of the glass in the via-hole conductor 14b in other insulating layers 11a and 11e is lower than a temperature when baking and shrinking of the dissimilar material insulating layers 11a and 11e start. COPYRIGHT: (C)2007,JPO&INPIT |
