| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable resin composition having reduced shrinkage in curing and excellent in adhesion to a substrate. SOLUTION: The invention relates to the curable resin composition comprising an alicyclic epoxy compound represented by formula (1) and a polymerization initiator for cationic polymerization or a curing agent. The polymerization initiator for cationic polymerization includes a thermal cationic polymerization initiator, photo cationic polymerization initiator. The curing agent includes a polybasic acid anhydride. The preferable alicyclic epoxy compound represented by formula (1) contains≤50 wt.ppm of free chlorine content. In the formula, R is a residue of a diol compound: HO-R-OH (2). (n) is an integer of 0-50 and optionally has a distribution. When containing the compound with n=0, the n has a distribution. COPYRIGHT: (C)2007,JPO&INPIT |
