| 摘要 |
PROBLEM TO BE SOLVED: To provide a piezoelectric vibrating reed for suppressing an increase in the number of steps even when the piezoelectric vibrating reed is bonded to a base by using the FCB (Flip Chip Bonding) method and to provide a piezoelectric vibrator. SOLUTION: Exciting electrodes 861, 862 and leadout electrodes 871, 872 are formed to both principal sides 841, 842 of the crystal vibrating reed (piezoelectric vibrating reed) 8, and the leadout electrodes 871, 872 are led out from the exciting electrodes 861, 862 to a base part 83. Leadout tip parts 881, 882 of the leadout electrodes 871, 872 formed to the base part 83 and electrode pads of the base 3 are bonded by a crystal vibrating reed bonding member 72 via a support member 5 to electrically connect the exciting electrodes 861, 862 to the electrode pads of the base 3. Further, the surface of chromium on the surface of leadout tip parts 881, 882 of the other principal side 841 of the crystal vibrating reed 8 formed at opposed positions 89 opposite to the leadout electrodes 871, 872 of the one principal side 842 is oxidized to be an insulating material. COPYRIGHT: (C)2007,JPO&INPIT
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