发明名称 |
Electronic part mounting method |
摘要 |
The present invention provides an electronic part mounting method which enables joining of electrodes at a low temperature and within a short time, can obtain the high reliability and, further, enables joining at a fine pitch. In an electronic part mounting method which joins circuit electrodes which are formed over a circuit board and die electrodes which are formed over the electronic parts thus mounting the electronic parts on the circuit board, a low-melting-point metal layer is preliminarily formed over the circuit electrode and/or the die electrode and, thereafter, the circuit electrode and the die electrode are arranged to face each other and are heated and pressurized for melting low-melting-point metal thus diffusing the low-melting-point metal into the circuit electrode and the die electrode by solid-liquid diffusion.
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申请公布号 |
US2007152025(A1) |
申请公布日期 |
2007.07.05 |
申请号 |
US20040591724 |
申请日期 |
2004.03.02 |
申请人 |
FUJI ELECTRIC HOLDINGS CO., LTD. |
发明人 |
FUJIMOTO KOZO;IKEMI KAZUTAKA;WATANABE HIROHIKO;MATSUMURA KEIICHI;SHIMODA MASAYOSHI;TANIGUCHI KATSUMI;GOTO TOMOAKI |
分类号 |
B23K31/02;H01L21/60;H05K3/32 |
主分类号 |
B23K31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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