| 摘要 |
The present invention provides a chip package structure, which includes a chip and a buffering compound, wherein the chip has an active surface, a back surface opposite to the active surface and a plurality of side surfaces joining the active surface and the back surface. The buffering compound is disposed at least on the active surface and the back surface, and the buffering compound possesses Young's modulus between 1 MPa and 1 GPa. The buffering compound contributes to reduce the negative effect of thermal stresses and accordingly advance reliability of the chip package structure. In addition, the present invention further provides a chip package process and based on the same reason the process is able to achieve a better production yield by forming a buffering compound surrounding the chip.
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