Integrated electronic component, has printed circuit board, and electronic power components that are arranged on board, where board has inner layer, which is made of heat conducting material e.g. solid copper

摘要

The component has a printed circuit board (10) e.g. multilayer printed circuit board, and electronic power components (11) that are arranged on the board. A housing is provided for partially surrounding the board. The board has an inner layer (12), which is made of a heat conducting material e.g. solid copper. The power components are thermally connectable with the inner layer by a contact opening (13), which is arranged transverse to the board and designed as a drill hole. A clamping edge (16) is designed for thermally dissipating the heat from the inner layer. An independent claim is also included for a cooling device for an integrated electronic component.