| 摘要 |
An apparatus and a method for exposing an edge of a substrate are provided to shorten a time required to expose the edge of the substrate by using a long-side exposing unit and a short-side exposing unit. An exposing apparatus includes a loading part(110) for loading a substrate and an edge exposing part(120) for exposing an edge of the wafer which is loaded by the loading part with a long-side exposing unit and a short-side exposing unit. A stage supports the substrate loaded by the loading part, and is moved in a first direction by a driving shaft. The driving shaft is guided by a rail. The wafer is exposed by the long-side exposing unit and the short-side exposing unit.
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