| 摘要 |
A method and apparatus for forming a multiple semiconductor die assembly ( 200, 300, 400 ) having a thin profile are presented. The semiconductor die assembly ( 200, 300, 400 ) comprises a plurality of die packages ( 100 ), with each die package ( 100 ) including a lead frame ( 10 ) having a plurality of leads ( 11 ) each having a down set portion ( 101 ) extending from ( 14 ). A semiconductor die ( 30 ) is disposed in a central region ( 12 ) of the lead frame ( 10 ) and is electrically connected ( 11 ). An encapsulant ( 50 ) is disposed in the central region ( 12 ) and covers to the semiconductor die ( 30 ) and a portion ( 11 ). The first surface ( 14 ) of the leads ( 11 ) and a first surface ( 34 ) of the semiconductor die ( 30 ) are substanial exposed from the encapsulant ( 50 ). The first surface ( 34 ) of the semiconductor die ( 30 ) and the down set portions ( 101 ) form a cavity ( 102 ). The semiconductor die packages ( 200, 300, 400 ) are stacked such that at least a portion of the encapsulant ( 50 ) is disposed in the cavity of a next higher semiconductor die package ( 200, 300, 400 ) in the stack. |
