发明名称 |
CAP TYPE ELECTROSTATIC CHUCK |
摘要 |
A cap type electrostatic chuck is provided to extend life span of the electrostatic chuck and to prevent a wafer contamination owing to particles by forming a separation layer having a superior electric resistance and chemical resistance on the surface of the electrostatic chuck. An electrostatic chuck(100) comprises the followings: a body(110) installed in a chamber; a plate(120) installed on the body; a wafer mounted on the plate; an internal electrode(130) built in the plate so as to generate electrostatic power for chucking the wafer. A cap type electrostatic chuck comprises; a shield ring formed on a peripheral surfaces contacting the wafer for attaching the plate to the upper surface of the body; a separation layer(140) having higher resistance quotient than the plate formed on the surface of the plate, so that the wafer is smoothly dechucked.
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申请公布号 |
KR20070070419(A) |
申请公布日期 |
2007.07.04 |
申请号 |
KR20050132930 |
申请日期 |
2005.12.29 |
申请人 |
KOREA SEMI TEK CO., LTD. |
发明人 |
LEE, DOO RO;KIM, DONG HAE;LEE, JUN HO |
分类号 |
H01L21/3065;H01L21/205 |
主分类号 |
H01L21/3065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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