发明名称 CAP TYPE ELECTROSTATIC CHUCK
摘要 A cap type electrostatic chuck is provided to extend life span of the electrostatic chuck and to prevent a wafer contamination owing to particles by forming a separation layer having a superior electric resistance and chemical resistance on the surface of the electrostatic chuck. An electrostatic chuck(100) comprises the followings: a body(110) installed in a chamber; a plate(120) installed on the body; a wafer mounted on the plate; an internal electrode(130) built in the plate so as to generate electrostatic power for chucking the wafer. A cap type electrostatic chuck comprises; a shield ring formed on a peripheral surfaces contacting the wafer for attaching the plate to the upper surface of the body; a separation layer(140) having higher resistance quotient than the plate formed on the surface of the plate, so that the wafer is smoothly dechucked.
申请公布号 KR20070070419(A) 申请公布日期 2007.07.04
申请号 KR20050132930 申请日期 2005.12.29
申请人 KOREA SEMI TEK CO., LTD. 发明人 LEE, DOO RO;KIM, DONG HAE;LEE, JUN HO
分类号 H01L21/3065;H01L21/205 主分类号 H01L21/3065
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