| 摘要 |
Provided is a photosensitive resin composition for fabricating a black matrix, which shows excellent heat resistance, chemical resistance, developing margin and adhesion to a substrate. The photosensitive resin composition comprises: (A) 1-40 parts by weight of a cardo-based monomer represented by the following formula(1); (B) 1-40 parts by weight of an acrylic-based binder resin represented by the following formula(2); (C) 1-20 parts by weight of an acrylic photopolymerizable monomer; (D) 0.1-10 parts by weight of a photopolymerization initiator; (E) 5-20 parts by weight of a black pigment; (F) 20-80 parts by weight of a solvent; and (G) 0.01-1 parts by weight of a silane coupling agent. In formula(1), R1 is H or methyl; R2 is H, a C1-C10 alkyl, aryl, phenyl, benzyl, C1-C8 hydroxyalkyl, C3-C8 epoxy-containing alkyl, or C3-C10 acryl-containing alkyl group. In formula(2), R is H, methyl or hydroxymethyl; R3 is a C1-C10 alkyl or aryl; R4 is a C1-C10 hydroxyalkyl; R5 is a C2-C15 alkyl, cycloalkyl or aromatic group-containing aryl; m is an integer of 10-90; n is an integer of 5-50; x is an integer of 5-50; and y is an integer of 5-50.
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