发明名称 |
COPPER ALLOY PLATE FOR ELECTRIC AND ELECTRONIC PARTS HAVING BENDABILITY |
摘要 |
<p>A Cu-Fe-P copper alloy sheet which has the high strength and the high electrical conductivity compatible with excellent bendability is provided. The Cu-Fe-P copper alloy sheet contains 0.01% to 3.0% of Fe and 0.01% to 0.3% of P on a percent by mass basis, wherein the orientation density of the Brass orientation is 20 or less and the sum of the orientation densities of the Brass orientation, the S orientation, and the Copper orientation is 10 or more and 50 or less in the microstructure of the copper alloy sheet.</p> |
申请公布号 |
EP1803829(A1) |
申请公布日期 |
2007.07.04 |
申请号 |
EP20050770465 |
申请日期 |
2005.08.11 |
申请人 |
KABUSHIKI KAISHA KOBE SEIKO SHO |
发明人 |
ARUGA, YASUHIRO;KAJIHARA, KATSURA |
分类号 |
C22C9/00;C22C9/02;H01L23/495;H05K1/09 |
主分类号 |
C22C9/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|