| 摘要 |
A jig for a wafer mapping sensor in a semiconductor manufacturing apparatus is provided to control the position of the wafer mapping sensor and to reduce an operating time of the wafer mapping sensor. A jig for a wafer mapping sensor in a semiconductor manufacturing apparatus includes a first body(110) with a sliding groove portion, a second body, a support part, a connection member and a control part. The second body(120) is loaded into the sliding groove portion. The second body moves in an X axis direction. The wafer mapping sensor is installed on the second body. The support part(150) is used for supporting the first body and moving the first body in a Z axis direction. The connection member(140) is used for connecting mechanically the first body with the support part. The connection member moves the first body in a Y axis direction. The control part is used for determining the existence of position error of the wafer mapping sensor. The control part controls the positions of the first body, the second body, the support part and the connection member.
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