| 摘要 |
Provided is an epoxy resin composition for encapsulating a semiconductor device, which avoids the use of a halogen-containing flame retardant generating harmful byproducts, and has excellent flame resistance, moldability and reliability. The epoxy resin composition for encapsulating a semiconductor device comprises: (1) an epoxy resin; (2) a curing agent; (3) a flame retardant; and (4) an inorganic filler, wherein the epoxy resin is a multifunctional epoxy resin represented by the following formula 1, the curing agent is a polyaromatic curing agent represented by the following formula 2, and the flame retardant is zinc borate represented by the formula of 2ZnO.3B_2O_3.3.5H_2O or hydrotalcite represented by the formula of Mg_4.5Al_2(H)_13CO_3.3.5H_2O. In formulae 1 and 2, n has an average value of 1-7.
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