| 摘要 |
Provided is an epoxy resin composition for encapsulating a semiconductor device, which avoids a need for a harmful halogen- or antimony-containing flame retardant, is eco-friendly, and shows excellent flame resistance and workability. The epoxy resin composition for encapsulating a semiconductor device comprises an epoxy resin, a curing agent, a curing accelerant, an inorganic filler, a flame retardant and other additives, wherein the flame retardant contains transition metal oxides represented by the formula of 2M_1x.3M_2yO_3.3.5H_2O (wherein M_1 is an element selected from Group IIB elements in the Periodic Table, M_2 is an element selected from Group IIIA elements in the Periodic Table, and each of x and y is an integer of 1-10) and the formula of M_a(OH)_b (wherein M is an element selected from Group IIB elements in the Periodic Table, and each of a and b is an integer of 1-10) in an amount of 1-10 wt% based on the total weight of the epoxy resin composition.
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