| 摘要 |
Provided is a radiation sensitive resin composition, which reproduces a desired dimension of a mask pattern with high sensitivity, has excellent adhesion to a substrate, and accomplishes a sufficient spacer shape and film thickness even under a low exposure dose, and imparts excellent compression strength to a spacer. The radiation sensitive resin composition comprises: [A] a copolymer of (a1) an ethylenically unsaturated carboxylic acid and/or ethylenically unsaturated carboxylic anhydride, (a2) an epoxy group-containing ethylenically unsaturated compound, and (a3) another ethylenically unsaturated compound; [B] a polymerizable compound having an ethylenically unsaturated bond; and [C] a radiation sensitive polymerization initiator essentially comprising a compound represented by the following formula(1) or (2). In formulae(1) and (2), each R^1 represents an alkyl or phenyl group, each R^2 represents H, an alkyl or phenyl group; and R^3 represents H or an alkyl group.
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