| 摘要 |
<p>The invention relates to a liquid cooling device for a computer, provided for a housing ( 1 ), enclosing a computer processor. In order to dissipate the heat by a radiant effect, the device advantageously comprises heat-removal means ( 20, 22, 23, 25 ) within the housing, attached to a lower wall ( 100 ), an upperwall ( 105 ) and at least one lateral wall ( 102, 103 ) of the housing ( 1 ). Each of the heat-removal means has two walls (P 1, P 2 ) at a separation from each other, made from a thermally-conducting material between which at least one circulation channel for a fluid is formed which is connected by a closed circuit ( 3 ) to at least one cooling element ( 61, 62, 63, 64, 65 ), attached to a power component in the computer. A pump ( 30 ), integrated in the circuit ( 3 ), circulates the fluid which permits a dissipation of the heat across the walls.</p> |
