| 摘要 |
A substrate cutting apparatus for pressing and distorting a substrate by using a vibrational roller is provided to promote crack propagation without direct application of the vibration to a cutter forming scribed intaglio lines by applying vibration or distortion to a brittle substrate to cut the same while forming the intaglio lines on the substrate. The apparatus includes: at least one wheel(41,42) for forming intaglio lines that is in contact with one side of a substrate(40); a wheel holder for rotationally fixing the wheel; a transportation device for moving the wheel holder and forming the intaglio lines on the substrate; and at least one roller(45,46) that is mounted on the rear of a propagating direction of the wheel holder and in contact with the wheel holder when the intaglio lines are formed. The roller is a plain roller and fixed to one side of the intaglio line or at a scrap substrate side around the intaglio lines. Alternatively, the roller is H form roller having H part on outer circumference thereof.
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