| 摘要 |
An apparatus and a method for cutting a substrate, which can prevent glass chips from sticking to the backside of the substrate by bending the dummy region upward and separating the substrate after fixing a dummy region of the substrate using a chuck, and a fabrication method of a liquid crystal display device using the substrate cutting apparatus are provided. An apparatus for cutting a substrate comprises: a conveyor(130) comprising a plurality of rollers(132) on which a substrate treated in a previous process is loaded, a cutting wheel(134) installed below the conveyor to form a predetermined cutting line on the substrate when the substrate is loaded on the conveyor, and a dummy separator(150) installed below the conveyor of the cutting wheel and provided under the predetermined cutting line-formed substrate to separate a predetermined cutting line-formed dummy region from the substrate completely. The cutting wheel is vertically moved under the conveyor to come in contact with the substrate loaded on the conveyor, and rotated round a rotary shaft(135) by a force applied from an external motor to form a predetermined cutting line. The dummy separator comprises a chuck(152), a rotary shaft(154), and a liftable and lowerable part(156).
|
