发明名称 |
Low out-gassing room temperature curable rubbery polymer, preparation thereof and device comprising same |
摘要 |
Disclosed is polymer materials essentially free of silicone capable of room-temperature thermal cure and when cured having low modulus, low out-gassing rate. The material before cure typically comprises three components: (i) a cationically curable component comprising the backbone of a hydrocarbon-based rubber material essentially free of carbon-carbon double bonds and triple bonds; (ii) a hydroxyl-containing component having at least two hydroxyl groups per molecule; (iii) an initiator component having essentially no volatility at room temperature and also yield products after polymerization that have minimal or no volatility at room temperature; (iv)an optional viscosity adjustment component either homopolymerizable or capable of copolymerizing with the photo or electron beam curable material component of (i); and (v) an optional non-alkaline inert filler. Also disclosed are process for making such cured material and devices comprising such cured polymer materials.
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申请公布号 |
EP1803768(A1) |
申请公布日期 |
2007.07.04 |
申请号 |
EP20060026934 |
申请日期 |
2006.12.27 |
申请人 |
CORNING INCORPORATED |
发明人 |
SHUSTACK, PAUL J. |
分类号 |
C08K5/053;C08L9/00;C08L19/00;C08L23/16;C08L63/08;C08L69/00;C08L71/02;C08L101/06;C09J109/00;C09J115/00;C09J119/00;C09J123/16;C09J163/08;C09J169/00;C09J171/02 |
主分类号 |
C08K5/053 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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