发明名称 MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME
摘要 A multi-layer printed circuit board and a manufacturing method thereof are provided to reduce the amount of pollutants by reducing the amount of high cost catalyst required for a masking process. A multi-layer printed circuit board includes a substrate(100), an SAM(Self-Assembled Membrane)(103), a catalyst layer(109), a metal membrane, and a first circuit. At least one minute hole is formed on the substrate. The SAM is formed on at least one surface of the substrate. The catalyst layer is formed on a surface of the minute hole on the substrate. The metal membrane is formed on the surface of the minute hole, where the catalyst layer is formed. The first circuit is formed on the SAM. The SAM includes a layer, which is formed by cathode and anode electrolyte solution.
申请公布号 KR20070072361(A) 申请公布日期 2007.07.04
申请号 KR20060120848 申请日期 2006.12.01
申请人 INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE;UNIMICRON TECHNOLOGY CORP. 发明人 YANG MING HUAN;WANG CHUNG WEI;WU CHIA CHI;CHENG CHAO KAI;TSENG TZYY JANG;LEE CHANG MING;YU CHENG PO;YU CHENG HUNG
分类号 H05K3/46 主分类号 H05K3/46
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