| 摘要 |
A tool tip of a bonding apparatus and an image display device manufactured by using the same are provided to improve an adhesive force between film components and prevent an increase in a connection resistance value by setting a width of the tool tip of the bonding apparatus and a width of an anisotropic conductive film to be the same as each other. A tool tip(120) of a bonding apparatus includes a first substrate and a second substrate respectively having circuit electrodes facing each other, and the first substrate and the second substrate are connected by using a fast curing anisotropic conductive film(10). A width of the tool tip is the same as or smaller than a width of the anisotropic conductive film. The width of the tool tip can be controlled. A bonding apparatus includes the tool tip. An image display device is manufactured by the tool tip. Connection resistance at a portion connected by the anisotropic conductive film is 1.0Ф. |
