| 摘要 |
<p>A cobalt-based alloy electroless-plating solution which is excellent in stability and can be used several times by suppressing spontaneous decomposition reaction, and can prevents the deterioration of quality of a film due to precipitates, an electroless-plating method for immersing a substrate into the electroless-plating solution or spraying the electroless-plating solution onto the substrate, and a thin film manufactured by the method are provided. In a cobalt-based alloy electroless-plating solution comprising a cobalt precursor, a tungsten precursor, a phosphorous precursor, a reductant, a complex compound-forming agent, a pH adjusting agent and a stabilizer, the cobalt-based alloy electroless-plating solution is characterized in that the reductant is dimethylamine borane or borohydride, and the stabilizer is at least one selected from the group consisting of an imidazole group, a thiazole group, a triazole group and a disulfide group. An electroless-plating method comprises the process of immersing a substrate on which a cap layer is to be formed into the cobalt-based alloy electroless-plating solution or spraying the cobalt-based alloy electroless-plating solution onto the substrate at a temperature of 15 to 95 deg.C for 1 hour or less to form a cobalt-based alloy thin film(a). The method further comprises the pre-treatment process of cleaning a surface of a copper substrate(b) passing through a planarization process. A cobalt-based alloy thin film having a thickness of 100 mum or less is manufactured by the electroless-plating method.</p> |
