| 摘要 |
The headphone device includes a sound amplifying part 21 composed of a first speaker 211 and a second speaker 212, a connecting member or headband 22 and fixing or securing members 23. The headband 22 is made of a flexible material e.g. silicone. So that the headphones adopt a compact form when not in use the speakers 211, 212 are brought together in the direction of the arrows C, and then the headband 22 is wound around the periphery of the speakers in the direction of the arrows D. The headband is held in this position by the securing means 231, 232 on each speaker or earpiece. |
