发明名称 Resistive element apparatus and method
摘要 A resistive element, a circuit board, and a circuit package, as well as a method of adding a resistive element to a circuit board are described. The resistive element includes a first contact point connected to a capacitor terminal, a second contact point connected to a circuit board plane, and resistive material connected to the first and second contact points. The invention may also include a circuit board with one or more resistive elements, as well as a circuit package, such as an integrated circuit or a discrete bypass capacitor, including one or more resistive elements, applied to an outside surface. The value of resistance for the resistive element can be selected by design to have a predetermined relationship with the equivalent resistance of an associated circuit board and connecting circuitry.
申请公布号 US7239524(B2) 申请公布日期 2007.07.03
申请号 US20010977124 申请日期 2001.10.12
申请人 INTEL CORPORATION 发明人 CHUNG CHEE-YEE;SANKMAN ROBERT L.;WAIZMAN ALEX
分类号 H05K7/02;H01L23/50;H01L23/64;H05K1/02;H05K1/09;H05K1/11;H05K1/16;H05K3/42;H05K7/06;H05K7/08;H05K7/10 主分类号 H05K7/02
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