| 摘要 |
A heat sink and an electronic apparatus are provided to enhance thermal stability of the electronic apparatus by coupling the heat radiating heat sink on an inner component of the electronic apparatus. A heat sink radiates heat from an electronic component and includes a main body(11) and a heat radiating unit(21). The main body has a junction surface which is attached to the electronic component. The heat radiating member has a joint surface which is coupled with a front surface. The front surface is arranged to face the junction surface. The heat radiating member includes a joint unit and a thermal radiating element. The joint surface is arranged on the joint unit. The thermal radiating element is arranged to be protruded to be substantially perpendicular to the joint unit. |
