发明名称 TEST SYSTEM FOR IMAGE SENSOR MODULE
摘要 A test system for an image sensor module is provided to test the image sensor module at a high temperature and a low temperature by controlling the temperature of a test socket. A test system for an image sensor module includes a test socket(110) in which the image sensor module(128) is mounted, a heater(136), a cooler(138), and a temperature controller. The heater heats the test socket up to a high temperature. The cooler cools the test socket to a low temperature. The temperature controller controls the heater and the cooler to adjust the temperature of the test socket. The image sensor module is tested at the high temperature and the low temperature. The test socket includes a metal circular plate which is electrically connected to the heater and the cooler to increase or decrease the temperature of the test socket.
申请公布号 KR20070069617(A) 申请公布日期 2007.07.03
申请号 KR20050131940 申请日期 2005.12.28
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 YAN, JAE HA
分类号 H04N17/00 主分类号 H04N17/00
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