发明名称 W POLISHING PAD OF CHEMICAL MECHANICAL POLISHING
摘要 A tungsten polishing pad of a CMP process is provided to perform stably the maintenance according to temperature by installing a temperature detecting sensor at a portion between a heating unit and a cooling unit. An automated temperature control device is installed at a polishing pad, so that the maintenance is properly controlled according to the temperature detected at the polishing pad. The automated temperature control device includes a heating part(110) on an upper pad(100) of the polishing pad, a cooling unit(210) on a lower pad(200) of the polishing pad, and a temperature detecting sensor(150) between the heating part and the cooling part.
申请公布号 KR20070069515(A) 申请公布日期 2007.07.03
申请号 KR20050131749 申请日期 2005.12.28
申请人 DONGBU ELECTRONICS CO., LTD. 发明人 JEONG, JAE DUK
分类号 H01L21/304 主分类号 H01L21/304
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