发明名称 |
LED array package structure and method thereof |
摘要 |
According to the method, a trench structure is formed in a substrate. LED arrays and driver ICs are located in the corresponding trenches. An insulating layer is formed over the substrate, the LED arrays and the driver ICs. A photolithography process forms an electrical connection structure between the LED arrays and the driver ICs. Then, a die-cutting process cuts out individual units. These units are fixed in a PCB and an electrical connection structure is formed between these units and input/output pins on the PCB.
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申请公布号 |
US7239333(B2) |
申请公布日期 |
2007.07.03 |
申请号 |
US20050038125 |
申请日期 |
2005.01.21 |
申请人 |
OPTO TECH CORPORATION |
发明人 |
TU SHUN-LIH;CHUANG CHIH-HUNG;CHUNG HUAI-KU;YANG CHIA-FENG;YANG CHENG-WEI;HAN TSU-AN;WANG HUNG-TUNG;HUNG CHIEN-CHEN |
分类号 |
B41J2/45;H01L33/08;H01L21/70;H01L21/77;H01L21/78;H01L27/00;H01L33/62 |
主分类号 |
B41J2/45 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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