发明名称 |
Printed circuit board including pads with vacancies |
摘要 |
Methods and apparatuses for affecting the frequency behavior of connections within a printed circuit board or an integrated circuit are disclosed. Some embodiments include a printed circuit board comprising, a plurality of conductive layers each comprising at least one conductive pad, where each conductive pad on the conductive layers includes a vacancy, and an insulating material disposed about the conductive layers such that the vacancies are at least partially filled with the insulating material.
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申请公布号 |
US7238892(B2) |
申请公布日期 |
2007.07.03 |
申请号 |
US20050188481 |
申请日期 |
2005.07.25 |
申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
发明人 |
BOIS KARL J.;QUINT DAVID W.;TSUK MICHAEL |
分类号 |
H05K1/16 |
主分类号 |
H05K1/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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