| 摘要 |
<p>A semiconductor chip stack package and its packaging method are provided to prevent an unwanted contact between a chip and a wire by stacking at least two semiconductor chips with stud pumps using a tape having wiring. First and second stud pumps(102,202) are formed on first and second semiconductor chips(100,200). The first semiconductor chip is attached on a substrate(300), before the first stud chip is inserted into a window of the substrate. A tape(400) is adhered on a surface of the substrate opposite to the first semiconductor chip to stack the second semiconductor chip. The second semiconductor chip is adhered on an upper surface of the tape.</p> |
