| 摘要 |
A semiconductor package is provided to prevent voids and warpage in an EMC(Epoxy Molding Compound) frame by coupling sectionally the EMC frame on a substrate. A semiconductor package includes a substrate, a chip(120) mounted on the substrate, a wire, an EMC, and an EMC frame. A window is formed at the center of the substrate(110), and a plurality of coupling holes are formed at edges of the substrate. The wire(140) is connected to the chip through the window. The EMC(150) is molded to the window for preventing the wire. The EMC frame(130) having a plurality of pins is coupled and injected to the coupling hole for preventing the chip.
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