SURFACE MOUNTING LED PACKAGE

摘要

A surface mounting LED(Light Emitting Diode) package is provided to prevent defect due to the excess or shortage of a solder by using a slot formed on the circumference of a heat transfer unit. A pair of lead frames are electrically connected to a circuit pattern of a substrate so as to provide power as well as to support an LED chip(102). The pair of the lead frames is spaced apart from each other. An insulating package body(130) surrounds the pair of lead frames. One of the lead frames a heat transfer unit and a lead(114) so as to support the LED chip as well as to be thermally connected to the substrate. The heat transfer unit is arranged on a lower center of an LED package and the lead is extended from the heat transfer unit to a lateral of the LED package. A slot(138) is formed on the circumference of the heat transfer unit at a bottom of the LED package.