发明名称 Metal-poly integrated capacitor structure
摘要 A metal-poly integrated capacitor structure that may be used in a charge pump circuit of a non-volatile memory. In one embodiment, the capacitor comprises a poly silicon layer, a first metal layer and a second metal layer. The first metal layer is positioned between the poly silicon layer and the second metal layer. The first metal layer has a first terminal and a second terminal. The first terminal is electrically isolated from the second terminal.
申请公布号 US7238981(B2) 申请公布日期 2007.07.03
申请号 US20040921463 申请日期 2004.08.19
申请人 MICRON TECHNOLOGY, INC. 发明人 MAROTTA GIULIO GIUSEPPE
分类号 H01L27/108;G11C5/14;G11C16/30;H01L27/08;H01L27/148 主分类号 H01L27/108
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