| 摘要 |
A method for manufacturing an LED(Light Emitting Diode) module is provided to blocking the external impact and to maintain air tightness by integrating a PCB(Printed Circuit Board) with an electric wire which are inserted into a resin material. A resin material is heated at a constant temperature to remove moisture(S1). The heated resin material is inputted into a heater to reheat it up to a preset temperature(S2). A substrate assembly is placed on a first upper-lower mold(S3). The substrate assembly is comprised of an LED provided on a PCB and electric wires connected to the LED. A resin is injected into the first upper-lower mold by controlling a resin injection pressure in stages to integrally form a first resin layer surrounding a bottom surface of the PCB and an edge of the substrate assembly(S4). The first upper-lower mold is cooled with a water cooling manner(S5). The substrate assembly with the first resin layer is placed on a second upper-lower mold(S6). A resin is injected into the second upper-lower mold by controlling a resin injection pressure in stages to integrally form a second resin layer surrounding the whole outer surface of the substrate assembly(S7). The second upper-lower mold is cooled with the water cooling manner(S8). |
