| 摘要 |
According to the invention, one or more external test connection contact points (pads; pins; balls), are provided in an integrated circuit component (chip) ( 1 ), through which signals ( 4, 5, 6 ) that are to be measured or analyzed are selectively fed, e.g. by means of a multiplex circuit ( 7,8 ), and wherein the signals may be connected by means of routes located internally in the component from switch points that are not directly accessible, e.g. points inside the chip ( 15 to 20 ) or covered contact points. The device according to the invention is particularly useful for highly integrated semiconductor chips.
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