ELECTRO-OPTICAL CIRCUIT BOARD AND FABRICATING METHOD THEREOF

摘要

An electro-optical circuit board and a fabricating method thereof are provided to reduce a volume of the board by embedding a passive element and a photoelectric element in the board. In an electro-optical circuit board, a resistance layer(100) and a capacitor layer(200) are bonded to each other by a first prepreg(610). The capacitor layer(200) is bonded to an inductor layer(300) by a second prepreg(630). The inductor layer(300) is bonded to a photoelectric element layer(400) by a third prepreg(650). The photoelectric element layer(400) is boned to an optical waveguide layer(500) by a transparent epoxy(670). An insulation layer(510) and an electrode(520) of the optical waveguide layer(500) are removed to be exposed. Reflective mirrors(571,572) are formed on the photoelectric element layer(400). A driver chip(710) for driving a light emitting device(420) and a light receiving device(430) and an IC chip for driving other electro-optical circuit board are formed on the electrode(520) of the optical waveguide layer(500). Via holes(800) and wiring patterns(850) are formed in the respective layers for electrically connecting the resistance layer(100), the capacitor layer(200), the inductor layer(300), the photoelectric element layer(400), and the optical waveguide layer(500).