POLYPROPYLENE HAVING A LOW COEFFICIENT OF FRICTION AND A LOW HEAT-ADHESIVE TEMPERATURE

摘要

A polypropylene resin composition for low-temperature heat adhesion is provided to reduce the coefficient of friction even without using a slip agent by controlling the amount of an anti-blocking agent added, and thus produce easily separable polypropylene films. The polypropylene resin composition for low-temperature heat adhesion comprises 100 parts by weight of a crystalline ethylene-propylene-1-butene terpolymer having a melting temperature of 125-135°C, 1-10 parts by weight of a low density polyethylene, and 0.1-1 parts by weight of an anti-blocking agent. The anti-blocking agent is a mixture of a silica-based compound and a polymethacrylic compound.