| 摘要 |
An apparatus for adjusting automatically the height of an exposure nozzle in a WEE(Wafer Edge Exposure) process is provided to prevent the exposure failure by controlling the distance between the exposure nozzle and a wafer surface in real time. An apparatus for adjusting automatically the height of an exposure nozzle in a WEE process includes a light emitting unit(30) for irradiating a detection light from an upper portion of an exposure nozzle, a lens unit(32) for reflecting partially the detection light irradiated from the light emitting unit and transmitting partially the detection light at a lower side of the light emitting unit, a PSD(Position Sensitive Detector) unit, a driving motor, and a control unit. The PSD unit(34) is used for detecting a first incident point of the detection light directly reflected from the lens unit and a second incident point of the detection light reflected from a wafer surface. The driving motor(38) is used for moving freely the exposure nozzle. The control unit(36) is used for checking the distance corresponding to the difference value between first and second incident points of the detection light and controlling the driving motor according to the results of the distance checking process.
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