| 摘要 |
An etching apparatus for use in fabrication of a semiconductor device is provided to easily mount or replace a guide ring when an O-ring groove is worn by plasma damage. An upper chamber(102) is communicated with a lower chamber(100). A cathode assembly(104) is installed in the lower chamber, and a wafer is loaded on the cathode assembly. A driving unit is connected to the cathode assembly to move the cathode assembly up and down. An inner wall mounting member(108) is mounted on an inner wall of the upper chamber. A guide ring is mounted on an O-ring groove of the inner wall mounting member to adjust an opened width of the O-ring groove, and an O-ring(122) is positioned in the O-ring groove.
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