| 摘要 |
Provided is a polyimide film having significantly improved adhesion and low shrinkability by heat. The highly adhesive polyimide film with low heat shrinkability is produced by performing an electrical discharge treatment on a polyimide film formed of paraphenylenediamine, 4,4'-diaminodiphenylether and pyromellitic dianhydride, and subsequently performing a heat treatment thereon while keeping a longitudinal tension constant, wherein the highly adhesive polyimide film has a surface free energy of 80 mN/m or more, as measured on the basis of a contact angle method, and a heat shrinkage of 0.10% or less at 200 deg.C for 1 hour.
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