| 摘要 |
A method for manufacturing a contact element of a probe card and the contact element manufactured therefrom are provided to attach exactly an aiming metal beam to a metal bump by removing bubbles and cracks from a photoresist layer using a photoresist removing process. A first photoresist layer is formed on a predetermined structure except for a metal line portion. A metal bump(400) is formed on the metal line portion. The first photoresist layer is removed therefrom. A sacrificial metal layer(500) is formed on the resultant structure instead of the first photoresist layer. At this time, the height of the sacrificial metal layer is the same as that of the metal bump. A second photoresist layer is formed on the resultant structure except a rod type space prolonged from an upper portion of the metal bump. A metal beam(700) is formed in the rod type space. The metal beam directly contacts the metal bump.
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