| 摘要 |
A chip on film is provided to enhance elasticity and to be applied to various IC(Integrated Circuit) chip mounting processes by using a polyimide film with high CD(Critical Dimension) stability and proper elasticity. A chip on film is formed by forming a metal line for mounting an IC chip on at least one side of a polyimide film(1). The polyimide film is made of a diamine element and a dianhydride acid element. The diamine element contains paraphenylene diamine and 4,4'-diaminodiphenylether. The dianhydride acid element contains pyromellitic acid dianhydride. The metal line is formed on the polyimide film without the use of adhesive.
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