| 摘要 |
A copper-attached plate is provided to secure excellent dimensional stability and heat resistance, to form fine wiring, and to prevent deformation even in using lead-free soldering. The copper-attached plate comprises a polyimide film consisting of paraphenylene diamine of 10~50mol.%, 4,4'-diaminodiphenyl ether of 50~90mol.%, and pyromellitic dianhydride of 100mol.% and a copper sheet formed by applying an adhesive agent on one or both surfaces of the polyimide film. The adhesive agent is not applied on one or both surfaces of the polyimide film, or applied on one surface of the polyimide film and not on the other surface. The polyimide film has elastic modulus of 3~6GPa, a coefficient of linear expansion of 5~20ppm/°C at 50~200°C, a coefficient of humidity expansion below 30ppm/%RH, absorptivity below 3.5%, and heating shrinkage below 0.10% at 200°C for one hour.
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