发明名称 METHOD OF FORMING ULTRA SHALLOW JUNCTIONS
摘要 THE PRESENT INVENTION RELATES TO A METHOD OF FABRICATING A SEMICONDUCTOR DEVICE (FIGURE 1). IN SPECIFIC EMBODIMENTS, THE METHOD COMPRISES PROVIDING A SEMICONDUCTOR SUBSTRATE, AND ION IMPLANTING DOPANT IMPURITIES OVER A TIME PERIOD INTO THE SEMICONDUCTOR DEVICE BY VARYING AN ION ENERGY (102) OF IMPLANTING THE DOPANT IMPURITIES (20) OVER THE TIME PERIOD.THE DOPANT IMPURITIES (20) ARE ACTIVATION ANNEALED TO FORM ONE OR MORE DOPED REGIONS (22) EXTENDING BELOW THE SURFACE OF THE SEMICONDUCTOR SUBSTRATE.THE ION ENERGY MAY BE VARIED CONTINUOUSLY OR IN A STEPWISE MANNER OVER THE TIME PERIOD (FIGURE 5), AND MAY ALSO BE VARIED IN A CYCLICAL MANNER (FIGURE 4).(FIG 2)
申请公布号 MY130338(A) 申请公布日期 2007.06.29
申请号 MYPI20034441 申请日期 2003.11.19
申请人 SILTERRA MALAYSIA SDN. BHD. 发明人 NARAYANAN MEYYAPPAN
分类号 H01L21/425;H01L21/265;H01L21/324;H01L21/336 主分类号 H01L21/425
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